Robotics Thermal Design Engineer, Optimus

Tesla is redefining the future of AI and hardware innovation. As a Robotic Thermal Design Engineer, you will define and implement thermal solutions for high-density AI silicon powering next-generation humanoid robotics. This role requires a practical, hands-on approach to solving complex thermal challenges at an architectural level, ensuring scalability, reliability, and manufacturability in high-volume production.

Responsibilities

AI Chip Thermal Architecture: Lead the thermal-aware co-design of the AI chip from the ground up. Define the physical integration strategy (e.g., 2.5D/3D structures, chiplet arrangements), guide the silicon floorplan, and influence the power delivery network to proactively mitigate hot spots and maximize performance within the robotic system Simulation & Validation: Build and correlate high-fidelity thermal models to predict silicon and module performance under real-world robotic operating conditions, including transient power spikes and harsh ambient environments. Validate designs through rigorous lab testing and data analysis Material & Component Selection: Characterize, select, and qualify cutting-edge thermal interface materials (TIMs), heat spreaders, and module-level thermal solutions. Drive the material roadmap to enable the thermal architecture of future product generations Cross-Functional Leadership: Drive thermal-aware silicon floor planning and design. Collaborate with silicon, package design, and cross functional teams to define architectural trade-offs between performance, cost, and mechanical reliability Manufacturing Support: Partner with manufacturing teams to resolve thermal-related yield issues, improve cost-effectiveness, and ensure seamless transitions from R&D to production

Requirements

Degree in Mechanical Engineering or a related field, or equivalent experience and evidence of exceptional ability Advanced proficiency in a major thermal simulation tool (e.g., Flotherm, Icepak) and hands-on experience with chip-level thermal design and integration Deep understanding of heat transfer principles (conduction, convection, radiation) and advanced silicon integration technologies (e.g., BGA, flip-chip, 2.5D/3D integration) Hands-on experience with material selection for thermal applications, including TIMs, phase-change materials, and designing module-level thermal solutions Problem-solving skills: Demonstrated ability to troubleshoot thermal failures, optimize designs for cost/performance, and drive solutions from concept to production Preferred: Experience with thermal management for AI accelerators (GPUs, TPUs), robotics, or automotive-grade electronics; familiarity with JEDEC/IPC standards; proficiency with scripting (Python, MATLAB) for data analysis and automation